WSM 310
PCB Width : 30 to 300 mm Board Handling : Fingers Preheat Length : 870mm (34.25") Preheat Method : IR + Convection Solder Pot Capacity : 90kgs single wave , 170 kgs double wave Max. Solder Pot Temperature : 300°C (572°F) Max. Conveyer Speed : 0.5 to 2.5 m / min / (98.4"/ min) Foam Fluxer Tank : 3 liters (0.8 gal.) System Features Finger conveyor far pallet-less operation Visibility throughout entire process...
Read More