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ECORELTM FREE 0307-16 is a no clean lead-free solder paste combining the metallurgical properties and cost benefits of a low silver alloy with high performance chemistry of the ECORELTM range. Very good wetting on any surface finish including OSP and strong anti-graping properties Robust assembly process for high volume electronics and complex boards Outstanding first pass yield testability in ICT Transparent and colorless residue even after multiple reflow...

ECORELTM FREE 0307-16 is a no clean lead-free solder paste combining the metallurgical properties and cost benefits of a low silver alloy with high performance chemistry of the ECORELTM range. Very good wetting on any surface finish including OSP and strong anti-graping properties Robust assembly process for high volume electronics and complex boards Outstanding first pass yield testability in ICT Transparent and colorless residue even after multiple reflow...

ECORELTM FREE 0307-16 is a no clean lead-free solder paste combining the metallurgical properties and cost benefits of a low silver alloy with high performance chemistry of the ECORELTM range. Very good wetting on any surface finish including OSP and strong anti-graping properties Robust assembly process for high volume electronics and complex boards Outstanding first pass yield testability in ICT Transparent and colorless residue even after multiple reflow...

ECORELTM FREE 0307-16 is a no clean lead-free solder paste combining the metallurgical properties and cost benefits of a low silver alloy with high performance chemistry of the ECORELTM range. Very good wetting on any surface finish including OSP and strong anti-graping properties Robust assembly process for high volume electronics and complex boards Outstanding first pass yield testability in ICT Transparent and colorless residue even after multiple reflow...

ECORELTM FREE 0307-16 is a no clean lead-free solder paste combining the metallurgical properties and cost benefits of a low silver alloy with high performance chemistry of the ECORELTM range. Very good wetting on any surface finish including OSP and strong anti-graping properties Robust assembly process for high volume electronics and complex boards Outstanding first pass yield testability in ICT Transparent and colorless residue even after multiple reflow...